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Bare chip mounting - List of Manufacturers, Suppliers, Companies and Products

Bare chip mounting Product List

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Bear chip implementation

Bear chip implementation

Consistent production from circuit board design to bare chip mounting! Abundant experience with high-difficulty projects.

We provide consistent support from circuit board design to ensure the characteristics of the entire module, rather than just partial implementation work, through wire bonding and flip chip mounting. We possess extensive know-how in the fields of wire bonding and flip chip using bare chips, and we may be able to resolve cases that other companies have declined. We are always mindful of cost and delivery time, and we can assist from the planning stage, so if you are a development manager facing challenges with bare chip mounting, please feel free to consult with us. 【Features】 ■ Support for small lots (from 1 piece) ■ Quick turnaround ■ Capable of mixed mounting with SMT components and leaded components *For more details, please refer to the related links or feel free to contact us.

  • Circuit board design and manufacturing

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ベアチップ実装＜高難度案件に対応＞

ベアチップ実装＜高難度案件に対応＞

豊富な実績で構想段階からご対応！車載、ハイブリッドIC、液晶ディスプレイなどに

当社では、基板設計から「ベアチップ実装」まで一貫生産を 行っております。 ワイヤボンディングをはじめ、フリップチップ、ダイシング といった高難度案件に対応。 微細素子高密度実装試作や高集積化実装、パッケージ開封による 障害解析などの実例がございます。 【サービスメニュー】 ■ワイヤボンディング ■フリップチップ ■ダイシング ※詳しくはPDFをダウンロードしていただくか、お気軽にお問い合わせください。

  • Circuit board design and manufacturing

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Micro Module Technology Corporation - Business Overview

Micro Module Technology Corporation - Business Overview

One-stop support for miniaturization and modularization of circuit boards using bare chip mounting, from concept to mass production!

We specialize in micro-joining technologies centered on bare chip mounting and inter-board bonding, providing support services that enable miniaturization, thinning, and high-function modularization of circuit boards. We offer one-stop support from concept planning through design, prototyping, evaluation, analysis, and small-to-medium scale production. Utilizing our in-house cleanroom facilities (Class 100–1000), customers can proceed with confidence even without in-house expertise or equipment. 【Benefits of Bare Chip Mounting】 ■Added Value ・Miniaturization and thinning expand product applications and contribute to the creation of new markets. ・Integrating semiconductor back-end processes enhances manufacturing value. ■Improved Cost Competitiveness ・Miniaturization and shared design improve production efficiency and help reduce material costs. ・Compared with SoC-based approaches, development costs can be significantly reduced in some cases. 　Effects vary depending on development conditions and specifications. ■Performance Improvement ・Eliminating secondary wiring shortens interconnections and improves electrical performance. ・Reduced wiring loss contributes to higher-speed operation and improved high-frequency characteristics. ■Environmental Considerations ・Reducing the number of materials used helps decrease waste and environmental impact.

  • Circuit board design and manufacturing

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